Whether you need prototypes, low volume or high volume production, we support a wide range of board-level technologies including:

Through-hole SMT BGA, microBGA, CGA, Flip Chip Lead-free processing RF Technology.

Our engineering team will work with you on design for manufacturability and design for testability (DFM/DFT) requirements. Ask for our free 102-page DFM/DFT Guide To Getting Increased Yields and Higher Reliability. It will give your designers the insight needed to design and develop the most stable, high yield and defect-free competitive products possible.